Xscape Photonics is a cutting-edge technology company developing advanced photonic systems for high-performance computing and communication applications. Our work focuses on enabling next-generation optical interconnects through innovative integration of photonics, electronics, and packaging technologies. We are building highly efficient, scalable solutions where thermal management plays a critical role in performance, reliability, and product success. About the Role We are seeking a motivated Thermal Engineer with 2+ years of experience to support the design, simulation, and testing of thermal solutions for photonic and electronic systems. This role involves developing cooling strategies for sensitive optical and electronic components using technologies such as thermoelectric coolers (TECs), thermal interface materials (TIMs), heat spreaders, vapor chamber along with air and liquid cooling systems. Responsibilities Design and analyze thermal management solutions for photonic devices and systems Develop cooling strategies using Thermoelectric coolers (TECs), Thermal interface materials (TIMs), heat spreaders and heat sinks, air cooling and liquid cooling approaches Perform thermal simulations to predict temperature distribution, heat flow, and thermal crosstalk Conduct thermal and fluid experiments to validate designs and models Set up and execute lab testing using thermocouples and temperature sensors, IR cameras for thermal imaging, data acquisition systems (e.g., LabVIEW-based setups) Analyze test data and correlate with simulation results Support design optimization for performance, reliability, and manufacturability Thermal review and documentation of results with the team members Qualifications Master’s or PhD in Mechanical Engineering, Aerospace Engineering, or related field with focus on heat transfer and fluid mechanics 2+ years of experience in thermal engineering or related field preferably in photonics applications Strong fundamentals in heat transfer (conduction, convection, radiation) and fluid flow Experience of CFD simulation tools for thermal analysis Hands-on experience with thermal testing and instrumentation Preferred Skills Experience with simulation tools including Ansys Icepack / Ansys Electronics Desktop, Ansys Mechanical, SolidWorks (CAD and thermal modules) Knowledge of programming and data analysis using MATLAB and/or python scripting for test automation and data processing Familiarity with electronics or photonics packaging is a plus Understanding of thermal reliability and material behavior (TIMs, interfaces, etc.) #J-18808-Ljbffr
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